New Vishay Intertechnology SMD MLCCs Offer Lead (Pb)‑Bearing Termination Finishes

New Vishay Intertechnology SMD MLCCs Offer Lead (Pb)‑Bearing Termination Finishes

With A Minimum Lead (Pb) Content of 4 %, Devices Mitigate Tin Whisker Formation

 

MALVERN, Pa. — Jan. 27, 2021 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new series of surface-mount multilayer ceramic chip capacitors (MLCCs) with a lead (Pb)-bearing termination finish suitable for low Earth orbit (LEO) satellites and other space, military, and avionics applications requiring tin whisker mitigation. Operating temperatures can be as high as +150 °C.

The Vishay Vitramon VJ....32 Lead-Bearing Finish series offers a termination finish with a minimum lead (Pb) content of 4 %. Previously, the option for lead (Pb)-bearing termination finishes was reserved for more expensive Hi-Rel devices. The MLCCs released today provide designers with a cost-effective alternative for aerospace systems in which tin whiskers must be avoided but space-level reliability isn’t required.

Manufactured in noble metal electrode (NME) technology with a wet build process, the VJ....32 Lead-Bearing Finish series is available with C0G (NP0) and X7R dielectrics in five body sizes from 0402 to 1210. Devices with a C0G (NP0) dielectric feature low capacitance down to 1.0 pF, a temperature coefficient of capacitance (TCC) of 0 ppm/°C ± 30 ppm/°C from –55 °C to +125 °C, and an aging rate of 0 % maximum per decade. X7R devices provide higher capacitance to 1.0 µF, TCC of ± 15 % from -55 °C to +125 °C, and an aging rate of 1 % maximum per decade.

The MLCCs are qualified according to AEC‑Q200 to provide designers with Automotive Grade reliability.

mount multilayer ceramic chip capacitors (MLCCs) with a lead (Pb)-bearing termination finish

                                                     

Product Benefits:

  • Termination finish with a minimum lead (Pb) content of 4 %
  • Operating temperatures as high as +150 ℃
  • Manufactured in noble metal electrode (NME) technology with a wet build process
  • Available with C0G (NP0) and X7R dielectrics in five body sizes from 0402 to 1210
  • C0G (NP0) dielectric:
    • Low capacitance down to 1.0 pF
    • Temperature coefficient of capacitance (TCC) of 0 ppm/°C ± 30 ppm/°C from –55 °C to +125 °C
    • Aging rate of 0 % maximum per decade
  • X7R dielectric:
    • Higher capacitance to 1.0 µF
    • TCC of ± 15 % from -55 °C to +125 °C
    • Aging rate of 1 % maximum per decade
    • AEC-Q200 qualified


Market Applications:

  • Power conditioning, signal coupling and decoupling, electronic noise filtering, and remote sensing
  • Low Earth orbit (LEO) satellites and other space, military, and avionics applications requiring tin whisker mitigation

 

Device Specification Table:

Dielectric

Case code

Maximum voltage (V)

Capacitance

Minimum

Maximum

C0G (NP0)

0402

100

1.0 pF

220 pF

0603

200

1.0 pF

820 pF

0805

500

1.0 pF

3.9 nF

1206

630

1.0 pF

8.2 nF

1210

630

100 pF

12 nF

X7R

0402

100

120 pF

33 nF

0603

200

330 pF

150 nF

0805

200

330 pF

470 nF

1206

630

220 pF

1.0 µF

1210

630

390 pF

1.0 µF

 

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